Flexible Printed Circuit with Stiffener
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Rigid Flex, 0.5 oz copper,1oz copper, Circuit board, Flexible printed circuit board
The material of stiffener could be polyimide or polyester.
Our Flexible Printed Circuit with Stiffener can be single sided, double sided, multilayer, and with SMT (surface-mount technology) to meet your particular needs.
An FPC can be bent and folded, improving the efficiency of the configuration and being able to last for a long period of time, having a temperature tolerance of 180 - 200°C.
Applications
- Game consoles
- Scientific devices
- Related Products
SMT Flexible Printed Circuit
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Double sided FPC. Assembled with components. Our SMT Flexible Printed Circuit can be single...
DetailsSMT Flexible Printed Circuit
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SMT Flexible Printed Circuit with white text printed on the cable, stiffener underneath the exit...
Details
How can flexible printed circuits improve your game console design efficiency and durability?
Yi Yi (SYN)'s flexible printed circuits with stiffener technology enable compact, high-performance designs for game consoles through superior bendability and folding capability. Our multilayer FPC solutions with SMT integration reduce assembly time and component count while maintaining reliability through 180-200°C temperature tolerance. Contact our engineering team to discuss custom FPC configurations that optimize your console's form factor and performance.
Our custom flexible printed circuit boards are manufactured to RoHS compliance standards and backed by comprehensive quality assurance protocols. Whether you require rigid-flex solutions, copper weight specifications (0.5 oz or 1 oz copper), or complex multilayer configurations, Yi Yi (SYN) delivers precision-engineered FPC products tailored to your specific application needs. With advanced R&D capabilities and proven expertise in electronic component manufacturing, we partner with leading manufacturers in computers, instruments, and electrical goods sectors to provide flexible circuit solutions that enhance product performance, reduce assembly complexity, and improve overall system efficiency.



